No visible tilt of the heatsink with respect to its attach mechanism. 4. No signs of physical damage on motherboard surface due to impact of heatsink or heatsink attach mechanism. 5. No visible physical damage to the processor package. 6. Successful BIOS/Processor/memory test of post-test...
No visible tilt of the heatsink with respect to its attach mechanism. 4. No signs of physical damage on motherboard surface due to impact of heatsink or heatsink attach mechanism. 5. No visible physical damage to the processor package. 6. Successful BIOS/Processor/memory test of post-test...