The short pulse widths and high pulse energy of this type of laser are well suited to cleanly machine these more difficult materials; at 500-Hz operation, it will deliver ~150 µJ of pulse energy with a 4-ns pulse duration (Figure 1). This translates into a high peak power (the rati...
Then Gray Relational Analysis (GRA) based multi response optimization of input process parameters for the outputs characteristics are performed to get the optimal conditions. The optimum machining parameters were found as; pulse frequency= 3 KHz, pulse width = 5% of duty cycle, diode current = 24...
Laser threshold and differential efficiency Passive Q-switching threshold phenomena, pulse forms, optimization for maximum output power and maximum output energy, shortest pulse conditions Internal frequency doubling in CW-operation External frequency doubling in Q-switched mode ...
Laser threshold and differential efficiency Passive Q-switching threshold phenomena, pulse forms, optimization for maximum output power and maximum output energy, shortest pulse conditions Internal frequency doubling in CW-operation External frequency doubling in Q-switched mode ...
Highest-speed dicing of thin silicon wafers with nanosecond-pulse 355nm q-switched laser source using line-focus fluence optimization technique Due to current and future anticipated widespread use of thin silicon wafers in the microelectronics industry, there is a large and growing interest in lase....
Proper ranges of process parameters such as pulse width, pulse frequency, amount of current, assist air pressure were purposed. Screening test shows O 2 as assist gas when used 0.2 to 1 kgf/cm 2 pressure range gives best result because of its advantage during laser material interaction. The...