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The average bondline temperature during the cure time will be somewhat lower than the oven temperature. 2The value in the denominator is the expected minimum 73°F (23°C) T-peel strength (piw) measured after the indicated cure cycle. NOTE: The data in this Technical Data Sheet were ...
performance, two-part epoxy adhesives offering outstanding shear and peel adhesion, and very high levels of durability.Features• High shear strength• Controlled flow • High peel strength• 60 minute worklife • Outstanding environmental performance• Non sag (Scotch-Weld DP460 NS)• Easy...
The average bondline temperature during the cure time will be somewhat lower than the oven temperature. 2The value in the denominator is the expected minimum 73°F (23°C) T-peel strength (piw) measured after the indicated cure cycle. NOTE: The data in this Technical Data Sheet were ...