Dowsil SYLGARD 184 PDMS 价格: 价格电议 产品详情:道康宁DC184 灌封胶是由液体组分组成的双组分套件产品,包括基本组分与固化剂。基本组分与固化剂按10:1重量比完全混合,中等粘度... 货号:DOWSIL 184 品牌:DOWSIL 分子式:Dow SYLGARD™ 184 Silicone Encapsulant Clear 有效物质≥:94 活性使用期:36月 工作温度...
Dow Corning 品牌 Silicone Encapsulants 两部silicone el
Silicone adhesives, sealants, conformal coatings, gels, encapsulants and thermal management products can be used for a wide variety of industries which include automotive, electronics, general industry, solar, aerospace and many more. You can count on DOWSIL™ assembly materials to help you develop...
UL黄卡查询 www.su-jiao.com/ul/ E40195 DOW CORNING CORP 3901 S SAGINAW RD, MIDLAND MI 48640-5
Plastic Encapsulant Materials HalehArdebili,Michael G.Pecht, inEncapsulation Technologies for Electronic Applications, 2009 2.4.1Dow Corning Materials More than 30 years were spent on the study ofsiliconesby Kipping, but the commercial value of silicones was not realized until 1943 when Corning Glass ...
184SILICONEELASTOMERKITNO 186ELASTOMERKITNO 200Fluid-allviscositiesNO 236DISPERSIONNO 3-4118GELA&BNO 3-4207DIELECTRICTOUGHGELKITNO 3-6060PRIMECOATNO 3-6385ENCAPSULANTKITNO 3-6512KITNO 3-6548RTVFOAMBNO 3-6548RTVSILICONEFOAM-PARTANO 3-6876BLACKADHESIVENO ...
Dow Corning Rohs list Product reference Contains substances restricted in RoHS and WEEE Directives * 1 CATALYST NO 1-2577 CONFORMAL COATING NO 1-2577 LOW VOC CONFORMAL COATING NO 1-2620 LOW VOC CONFORMAL COATING NO 1-4173 TC ADHESIVE NO 1000 PASTE NO 1000 SPRAY NO ...
Plastic Encapsulant Materials HalehArdebili,Michael G.Pecht, inEncapsulation Technologies for Electronic Applications, 2009 2.4.1Dow Corning Materials More than 30 years were spent on the study ofsiliconesby Kipping, but the commercial value of silicones was not realized until 1943 when Corning Glass ...
道康宁OE6636(Dow Corning OE6636)道康宁OE6636(Dow Corning OE6636)为道康宁公司旗下电子部门于2009年7月推出的新型硅封胶(silicone encapsulant)产品,该产品是特别为覆盖成型制程(压缩成型)和点胶制程的LED封装所研发。道康宁OE6636(Dow Corning OE6636)的特性:1、拥有(RI)1.54的高折射率,使其具有更高效率的光输...
Fillers can also be added to compositions utilized as encapsulants and molding compounds. The solid inorganic fillers, either particulate or fibrous, are generally present in an amount in the range of 30 to 90 weight percent base on the total weight of molding compound. Of the previously-describ...