一种提高DIMM测试效率的方法,利用FPGA验证系统编程的灵活性,实现DIMM逻辑,构建DIMM测试系统,并且具备支持UDIMM和RDIMM功能,其中,由现场可编程门阵列FPGA芯片,通用控制芯片,通用高速接口和多通道DIMM接口组成DIMM验证系统;Host主设备端通过高速接口向系统发送读写指令,控制芯片负责指令解析及通过控制DIMM逻辑来对待测试DIMM进行...
A double sided single inline memory module (20) comprising a substrate (70) having a plurality of openings (86) and first and second surfaces (92, 94), a plurality of pads (82) being integral with the substrate (70) and extending into the opening (86), a plurality of chips (50) ...
Buffer chip for the drive of external input signals, on which a large amount of compartment rank - double rows of memory module (mr - dimm) are applied to a predetermined number (n) of memory chips, which on a printed circuit board, of the double rows of memory module are fastened,the...
DOUBLE SIDED SINGLE INLINE MEMORY MODULE\nABSTRACT OF THE DISCLOSURE\nA double sided single inline memory module (2D) comprising a substrate (70) having a .plurality of openings. (86) and first and second surfaces (92 ; 94) , a plurality of` pads ( 8 2 ) being .integral with the ...
Double sided single inline memory module 专利名称：Double sided single inline memory module 发明人：Boon Pew Chan,Kian Teng Eng 申请号：US08/994955 申请日：19971219 公开号：US05998860A 公开日：19991207 专利内容由知识产权出版社提供 摘要：A double sided single inline memory module (20) comprising ...
40\nHIGH DENSITY DOUBLE SIDED SINGLE INLINE MEMORY MODULEABSTRACT OF THE DISCLOSUREA high density double sided single inline memory module(140) comprising a printed circuit board (132) and first andsecond integrated circuit modules (130) respectively attachedto the first and second sides (134, 136...
A double sided single inline memory module (20) comprising a substrate (70) having a plurality of openings (86) and first and second surfaces (92, 94), a plurality of pads (82) being integral with the substrate (70) and extending into the opening (86), a plurality of chips (50) ...