Latch and handle arrangement for a telecommunications panel.The Patent Description & Claims data below is from USPTO Patent Application 20100107395, Latch ... A Gmbh 被引量: 3发表: 0年 AUTOMATION OF TIE CELL INSERTION, OPTIMIZATION AND REPLACEMENT BY SCAN FLIP-FLOPS TO INCREASE FAULT COVERAGE A...
Patent Issued for Semiconductor chips including through electrodes and methods of testing the through electrodes (USPTO 11476169) Reporters obtained the following quote from the background information supplied by the inventors:\n"The present application is a divisional application of ... - 《Electronics...
The Patent Description & Claims data below is from USPTO Patent Application 20110038286, Using frequency divisional multiplexing for a high speed serializer/deserializer with back channel communication. US 20110038286 A1 20110217 US 12773115 20100504 12 20060101 A H 04 L 5 14 F I 20110217 US B H ...