QFN封装(Quad Flat No-leads Package)景。QFP封装(Quad Flat Package)TSSOP(Thin Shrink Small Outline Package)DIP封装(Dual Inline Package)PLCC(Plastic Leaded Chip Carrier)封装SOP封装(Small Outline Package)PGA封装(Pin Grid Array)
16 Pin Open top, SOP, TSOP type I & II package test socket Open top test socket Compatible SOIC Package Drawing SOIC Package Type 16 Pins 5.3mm (209 mils) Package body width 7.7mm (303 mils) Leads tip to tip 1.27mm (50 mil) Pitch device Mfr. Yamaichi Status - IN STOC...