Data on different types of silicon wafersWaferTypes
F. The Effects of Different Types of Nano-Silicon Dioxide Additives on the Properties of Sludge Ash Mortar Journal of the Air & Waste Management Association 59 2009: pp. 440 - 446. http://dx.doi.org/10.3155/1047-3289.59.4.440Wang, C., Xi, J. Y., Hu, H. Y., Arhami, M., ...
Many types of capacitors used for such applications currently and historically are some of the most prone to energy storage by dielectric absorption, with some being capable of “self-charging” to perhaps a fifth of the voltage previously applied. With larger devices, the energy & voltage present...
Efficient flexible thin film silicon module on plastics for indoor energy harvesting. Sol. Energy Mater. Sol. Cell 130, 490–494 (2014). Article CAS Google Scholar Yue, X. et al. Development of an indoor photovoltaic energy harvesting module for autonomous sensors in building air quality ...
General Characteristics of Catalysts催化剂的一般特性 The majority of solid catalysts are metals (e.g., platinum or nickel) or near-metals (e.g., silicon, boron and aluminum) attached to elements such as oxygen and sulfur. Catalysts that are in the liquid or gas phase are more likely to ...
Electroluminescent polymers (ELPs) in the active layers of light-emitting capacitors (LECs) emit light when an electric current passes through them. Due to their chemical and electrical structure, conjugated polymers can act as ionic conductors and semiconductors. 5. Silicon Capacitor Symbols Tuning ...
In this study, hydrogenated amorphous silicon (a-Si:H) single junction and amorphous/microcrystalline silicon tandem (a-Si:H/c-Si:H) solar cells with different back-reflectors (BRs) are systematically investigated. A novel white polyvinyl butyral (PVB) foil was used as BR. In addition, the...
Semiconductor memory will be made of integrated circuits with silicon-based metal-oxide-semiconductor (MOS) transistors. Types of computer memory Memory can be divided into primary and secondary memory. There are many types of primary memory, including the following: Cache memory. The temporary ...
1, one embodiment of the present invention is shown. In this embodiment a semi-conductor chip 10 is provided which typically is a silicon chip which has thereon logic circuits 12 and memory array circuits 14. (Memory array circuits may sometimes be referred to herein as array circuits.) The...
In FIG. 13 the phase plate pattern 19 is formed by first depositing a dielectric film of silicon oxide (SiO2) or a similar compound on to the glass substrate 18. Firstly, the formation of the phase plate pattern 19 will be described where its cross-section as shown in the phase plate ...