Compensating CMP (CCMP) decreases the polishing pad wear and enhances end-point detection (EDP). In CCMP, a polishing pad is placed above the wafer and does not completely cover the wafer. Regardless of CMP or CCMP, there are grooved patterns on the polishing pads. However, on the ...
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6. The method of claim 2, wherein the gate silicide regions each have a thickness greater than a thickness of any of the substrate silicide regions. 7. The method of claim 2, wherein said planarizing includes chemically-mechanically polishing, the polysilicon surface is generally coplanar with...
In a typical CMP process, two polishing pads are used. The semiconductor wafer is first polished by using a hard pad on a primary rotating table. The hard pad increases the planarity of the wafer. The wafer is then polished by using a soft pad and a lower downward force on a secondary...
Larger apertures of the new pads are effective in both recycling of slurry and removing of polishing wastes. The experiment was designed based on the Taguchi method for polishing monocrystalline silicon with two types of pads. Type A involves coating the surface of the HMA pad with SiC abrasive...
Lin ZC, Huang WS, Tsai JS (2012) A study of material removal amount of sapphire wafer in application of chemical mechanical polishing with different polishing pads. J Mech Sci Technol 26(8):2353–2364 View ArticleLin ZC, Huang WS, Tsai JS (2012) A study of material removal amount of ...
The present invention is directed to polishing pads useful in determining an end to the useful wear life thereof. In a simple embodiment of the present invention, a polishing pad that is used with slurries is dyed on one side in a manner that causes the dye to permeate the pad to a ...
Bonnet polishingPolishing padTool path ripple (TPR)Tool influence function (TIF)Bonnet polishing, which is a sub-aperture polishing method, is crucial to the production of aspherical lenses. However, sub-aperture polishing generates regular residual periodic ripples, which result in tool path ripple ...
A handheld mechanical tool configured to realize two different types of work operations for sanding or polishing a workpieceProblem to be solved: to provide an improved machine tool capable of performing two different types of work motions. The mechanical tool 1 is provided with a housing 2, a ...