在处理器上叠加Magnetic Random Access Memory (MRAM)或Phase Change Random Access Memory (PRAM)可以实现具有独特功能的新一代处理器架构,如下图,它们具有0待机功率、低访问功率以及不受辐射引起的错误等特点。 光器件层Stacking 如上图,对于片外通信来说,电信号的引脚限制、功耗、信号衰减等是是呆滞带宽不足的重...
基于3DMesh结构的一种静态路由算法 基于Mesh拓扑的3D NoC路由算法研究 一种基于3Dmesh的NOC路由算法设计与分析 基于3D Mesh结构的一种静态路由算法 一种新的基于mesh结构的多径路由算法 3D Stacking Technology Die Stacking (3D) Microarchitecture:芯片堆叠(3D)微体系结构 格式...
Die stacking recessed pad wafer designRichard P. Rangel
Die Stacking with Overhang 3D IC Pyramid Assembly There are risks associated with stacking two or more KGD together, since one KGD can function independently well, but within a stack assembly it may not as effectively. Rework may be required to remove the bad die or the entire stack-die asse...
Die stacking technologies have been demonstrated up to 24 die stacks, however, most stack-ups greater than 9 die high use a combination of die and package stacking technologies to address complex test, yield and logistic challenges. Die stacking is also widely deployed in conventional leadframe-ba...
Embodiments of a die stacking apparatus are provided. The die stacking apparatus includes a storage device configured to contain a top wafer and an interposer wafer. The top wafer has a number of top dies, and the interposer wafer has a number of interposer dies. The die stacking apparatus al...
The present subject matter can provide a solution to stacking a die (e.g., an upper die) across one or more lower dies in an electronic package, such as attaching an upper die to a plurality of lower dies where the lower dies have variation in height from a substrate or where the low...
1) die stacking 裸片叠层,芯片叠积 2) Bare chip laminate 裸芯片叠层 3) Multi-Stack Die 多叠层芯片 4) MCM-L 叠层多芯片组件 5) MCM stacking 多芯片模块叠层 6) stacked die package 叠层芯片封装 1. The finite element analysis(FET)software ANSYS have been used to simulate the temperature ...
Edge interconnects for die stacking 优质文献 相似文献 参考文献 引证文献L-connect routing of die surface pads to the die edge for stacking in a 3D array Integrated circuit chips and method of routing the interface pads from the face of the chip or die to one or more sidewall surfaces of the...
backside processing, (iv) assembly using die-to-die, die-to-wafer or wafer-to-wafer stacking, (v) wafer test and burn-in, (vi) power delivery, ... LW Kong,S Niese,A Diebold,... - John Wiley & Sons, Ltd 被引量: 1发表: 2012年 SEMICONDUCTOR DEVICE INCLUDING BACK SIDE POWER SUPPLY...