1. Die shear adhesion test was fairly inconsistent in the measure load as well as the failure mode. 2. Die shear adhesion test did not produce a clean failure surface, all failures were either completely in the silicon or a mix mode. 3. Die adhesion test showed a large decrease in ...
The die attach structure using a Ag flake paste had an initial shear strength of over 45 MPa due to the excellent sinter-joining ability of the paste. Variation of die attach shear strength and failure mode under a harsh cycling condition (50~250°C) have also been systematically discussed....
Failuresfrom die shear testing include: 1) failure to meet the specified die shear strength requirements; 2) a separation that occurs at less than 1.25X the minimum die shear strength and evidence of less than 50% adhesion of the die attach material; and 3)a separation that occurs at less ...
The effects of temperature-time-pressure sintering profile on die-shear strength, electrical resistivity, and microstructures were investigated. The oxidation-free, sintered copper bond-lines had electrical resistivity as low as four times of the bulk value, and strong bonding strength over 65 MPa ...
by a tweezer or other specially designed tooling. Depending on the stud pull application, xyztec can offer solutions from a few grams up to 500kgf. We also offer a manual tweezer that can test up to 40kgf and an optional camera system is available to record and analyze failure mode. ...
Therefore, when the lap-shear force is applied, the fracture occurs on the upper sheet and is accompanied by a lower strength. However, the USF mode exhibits larger displacement by tearing the upper sheet compared to the other two modes, refer to Fig. 16(a), and results in much higher ...
Punching shear modes of failure observed in all test locations also strengthened the argument for the... CS Klowak 被引量: 0发表: 2016年 Mode I inter-laminar Fracture Toughness and Bending Strength of Ultra-sonic Needle Punched CFRTP The four-point bending test and double cantilever beam (...
11.Shear Strength of Flip Chip Packaging Bonded with Anisotropic Conductive Film倒装芯片各向异性导电胶互连的剪切结合强度 12.Failure Mode of Die Bonding and Improved Path of Bonding Strength芯片粘接失效模式及粘接强度提高途径 13.Prediction of Burst Strength of Oil Well Casing Strings with Micro-Cracks含...
Wereley NM, Cho JU, Choi YT, Choi SB (2008) Magnetorheological dampers in shear mode. Smart Mater Struct 17(1):015022 Article Google Scholar Spencer BF Jr, Dyke SJ, Sain MK, Carlson JD (1997) Phenomenological model for magnetorheological dampers. J Eng Mech 123(3):230–238 Article Googl...