Semiconductor system having bga package with radially ball-depopulated substrate zones and board with radial via zonesA printed circuit board has contact lands ( 710 ) forms an array with depopulated elongated zones ( 820 ), which are radially oriented from the board center towards the board ...
In one embodiment, a ball grid array (BGA) of a packaged semiconductor device and a corresponding landing pad array of a printed circuit board each have a layout defined by an interconnection array having (i) an inner sub-array of locations having connectors arranged in rows and columns ...
In one embodiment, a ball grid array (BGA) of a packaged semiconductor device and a corresponding landing pad array of a printed circuit board each have a layout defined by an interconnection array having (i) an inner sub-array of locations having connectors arranged in rows and columns ...