(11') formed in the central parts of the holes, respectively; a nozzle plate layered on the semiconductor substrate to cover the holes and formed with an opening unit with the predetermined radius about the micro tips; first electrodes(15) deposited on the upside of the micro tips; and ...
(11') formed in the central parts of the holes, respectively; a nozzle plate layered on the semiconductor substrate to cover the holes and formed with an opening unit with the predetermined radius about the micro tips; first electrodes(15) deposited on the upside of the micro tips; and ...