使用功率模块的特定传递模具封装材料(环氧树脂 - 葡萄干涂层)来解决冲击和振动要求,如图1所示。 为了达到最大功率循环性能和使用寿命,DCM 1000X平台模块使用Danfoss Bond Buffer技术(DBB),DCM 1000也是如此.DBB可以在更高的结温下运行。与任何其他标准键合和连接技术相比,烧结半导体到基板结合DBB和铜线键合提供更高的功...
This paper considers the design, simulation and experimental validation of a fully integrated DC-link capacitor and busbar "application kit" exclusively designed to enhance the performance of Danfoss' direct cooled molded DCM1000X platform, utilizing the latest generation of 1200 V SiC MOSFET with a...