使用功率模块的特定传递模具封装材料(环氧树脂 - 葡萄干涂层)来解决冲击和振动要求,如图1所示。 为了达到最大功率循环性能和使用寿命,DCM 1000X平台模块使用Danfoss Bond Buffer技术(DBB),DCM 1000也是如此.DBB可以在更高的结温下运行。与任何其他标准键合和连接技术相比,烧结半导体到基板结合DBB和铜线键合提供更高的功...
To reach maximum power cycle performance and lifetime, the DCM 1000X platform module uses Danfoss Bond Buffer technology (DBB), as does DCM 1000. DBB enables operation at higher junction temperatures. Sintered semiconductors to substrate combined with DBB and copper wire bonding offers ...
This paper considers the design, simulation and experimental validation of a fully integrated DC-link capacitor and busbar "application kit" exclusively designed to enhance the performance of Danfoss' direct cooled molded DCM1000X platform, utilizing the latest generation of 1200 V SiC MOSFET with a...