multi-chip for flip chipfor die-attachepoxy multi-chip for flip chip die bonderDatacon 2200 evo hF multi-chip for flip chip die bonderDatacon 2200 evo advanced for die-attachepoxyautomated See all BE Semiconductor Industries N.V. products...
multi-chip for flip chip die bonderDatacon 2200 evo hF fully-automatic die bonderDatacon 2200 evo hS multi-chip for flip chipfor die-attachepoxy multi-chip for flip chip die bonderDatacon 2200 evo advanced for die-attachepoxyautomated
半导体多芯片贴片机 Datacon 2200evo 只看楼主收藏回复 芯征途 铁杆吧友 8 Besi公司Datacon固晶机多芯片贴装、贴装精度最高可达±7um灵活的点胶模式(蘸胶、点胶、画胶)可适用UV胶、银胶、环氧胶、焊片等支持芯片多种来料方式:wafer、华夫盒、gel–pak盒、tray盘、飞达等多顶针设计多吸嘴切换用于半导体sip封装...
BesiDatacon2200evo粘片机 TheDatacon2200evohigh-accuracymulti-chipdiebonderprovidestheultimateflexibilityfordieattachaswellasforflipchipapplications.Equippedwithintegrateddispenser,12”waferhand领,automatictoolchanger,andapplicationspecifictoo领,theDatacon2200evoispreparedforpresentandfutureprocessesandproducts. KeyFeatures...
Besi Datacon 2200 evo hS 粘片机Innovative Solution for Innovative Products The Datacon 2200 evo hS die bonder for Multi Module Attach assembles all kinds of technologies on a tried-and-tested platform, enhanced with key features for higher bonding accuracy and lower cost of ownership. Besides ...
中国芯 多die贴片机Datacon 2200evo固晶机 只看楼主 收藏 回复 半导体江湖小牛 KX-6000 4 半导体江湖小牛 KX-6000 4 半导体江湖小牛 KX-6000 4 Datacon 2200evo 裸芯片贴放精度±10um,微电子组装 芯片贴装登录百度账号 下次自动登录 忘记密码? 扫二维码下载贴吧客户端 下载贴吧APP看高清直播、视频! 贴吧...
议价Datacon 2200EVO 贴片机主机 已售少于100 ￥5312点击查看更多配送: 广东东莞至 阳泉城区 快递: 免运费现货,付款后48小时内发货 保障:7天无理由退货查看更多 用户评价 参数信息 图文详情 本店推荐 用户评价 参数信息 品牌 无品牌/无注册商标 售后服务 其他 图文详情 本店推荐 议价苏州安泰苏净安泰生物安全柜...
Datacon 2200 evo hS Innovative Solution for Innovative Products Future Proof Equipment The Datacon 2200 evo hSdie bonderfor Multi Module Attach assembles all kinds of technologies on a tried-and-tested platform, enhanced with key features for higher bonding accuracy and lower cost of ownership. ...
800G光模块 多芯..光模块COB封装工艺流程1、PCB清洗(可选激光清洗或等离子电浆清洗)2、芯片贴装、固晶/die bond(LD、PD、TIA芯片的贴装)3、引线键合/wire bond4、贴透镜对光耦合5、胶水固化
Besi Datacon 2200 evo 粘片机 The Datacon 2200 evo high-accuracy multi-chip die bonder provides the ultimate flexibility for die attach as well as for flip chip applications. Equipped with integrated dispenser, 12” wafer handling, automatic tool changer, and application specific tooling, the ...