S Kenta,T Yuki,U Junichi,K Yosuke,N Yuya 摘要: The present invention provides a polishing head configured to hold a wafer, and perform polishing by rotating the wafer within a polishing surface of a polishing pad while applying pressure to the wafer and pressing the wafer against the ...
目的:观察针刺扳机点结合筋膜松解术治疗慢性腰部肌筋膜疼痛综合征的疗效及对肿瘤坏死因子-α(TNF-α),白介素-1β(IL-1β)水平的影响.方法:选取我院2019年2月～2020年1月治疗的慢性腰部肌筋膜疼痛综合征患者106例,按照随机数字表法分为两组,各53例,对照组采用常规针刺法治疗,观察组采用针刺扳机点结合筋膜松解术...