Note:Part number description table describes usual part-numbering system for more chips, therefore this table can contain information, that might not be valid for the actually selected chip. The information here are provided on the best-effort basis and might be either inaccurate or incoplete. The...
2. This drawing is subject to change without notice. 3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance. www.ti.com RHR0028A 28X (0.6) 28X (0.25) 1 EXAMPLE BOARD LAYOUT WQFN - 0.8 mm max height PLASTIC QUAD FLATPACK - NO...
Note:Part number description table describes usual part-numbering system for more chips, therefore this table can contain information, that might not be valid for the actually selected chip. The information here are provided on the best-effort basis and might be either inaccurate or incoplete. The...