Thermal Specification (°C) is for the highest VID only 10. Thermal Design Power (TDP) should be used for processor thermal solution design targets. The TDP is not the maximum power that the processor can dissipate 11. This table shows the maximum TDP for a given frequency range. Individual...
✅ You want the best gaming CPU: If you're after the processor which offers you the best chance of getting the highest frame rates out of your graphics card, then this is it.✅ You want an efficient gaming chip: This chip offers lower power draw and temperatures than any other modern...
[2]MLN-016: Results as of 01/28/2021 using SPECrate®2017_int_base. The AMD EPYC 7763 a measured estimated score of 798 is higher than the current highest 2P server with an AMD EPYC 7H12 and a score of 717, https://spec.org/cpu2017/results/res2020q2/cpu2017-20200525-22554.pdf....
There are a few peculiarities about this motherboard, so make sure you also check out our article about thebest motherboards for this CPU. AMD’s Take on the Ryzen 7 3700X: Features & Specifications AMD Ryzen™ 7 3700X Specification # of CPU Cores – 8 # of Threads – 16 Base Clo...
[2] MLN-016: Results as of 01/28/2021 using SPECrate®2017_int_base. The AMD EPYC 7763 a measured estimated score of 798 is higher than the current highest 2P server with an AMD EPYC 7H12 and a score of 717, https://spec.org/cpu2017/results/res2020q2/cpu2017-20200525-22554.pdf...
EDX Bits 15-00: Highest COS number supported for this ResID. Bits 31-16: Reserved. Intel® SGX Capability Enumeration Leaf, Sub-leaf 0 (Initial EAX Value = 12H, ECX = 0) 12H NOTES: Leaf 12H sub-leaf 0 (ECX = 0) is supported if CPUID.(EAX=07H, ECX=0H):EBX[SGX] = 1. ...
Highest safety class achievable in safety mode ● Performance level according to ISO 13849-1 PLe ● SIL acc. to IEC 61508 SIL 3 Probability of failure (for service life of 20 years and repair time of 100 hours) — Low demand mode: PFDavg in accordance with SIL3 < 2.00E-05 ...
CPU Specification Comparison CPU Manufacturing Process Cores GPU Transistor Count (Schematic) Die Size Intel Haswell-E 8C 22nm 8 N/A 2.6B 356mm2 Intel Haswell GT2 4C 22nm 4 GT2 1.4B 177mm2 Intel Haswell ULT GT3 2C 22nm 2 GT3 1.3B 181mm2 Intel Ivy Bridge-E 6C 22nm 6 N/A...
Highest DPC routine execution time (µs): 314.29850 Driver with highest DPC routine execution time: ndis.sys - Network Driver Interface Specification (NDIS), Microsoft Corporation Highest reported total DPC routine time (%): 0.288840 Driver with highest DPC total execution time: cmudaxp.sys - C...
Highest Turbo Frequency 3.4 GHz Support Maximum Memory 2 Tb PCI Express Version Pcie 4.0 Warranty 3 Years Transport Package Original Boxes Specification 37.5 X 37.5mm Trademark AMD Origin China HS Code 84713000 Production Capacity 20000 Pieces/P...