CPU Compute Die (CCD) Size 180mm² Package Die Count 1 Unlocked for Overclocking Yes CPU Socket AM4 Thermal Solution (PIB) AMD Wraith Stealth Thermal Solution (MPK) AMD Wraith Stealth Max. Operating Temperature (Tjmax) 95°C Launch Date 1/8/2024 *OS Support Windows 11 - 64-Bit Edition...
Processor Technology for CPU CoresTSMC 7nm FinFETCPU Compute Die (CCD) Size180mm²Package Die Count1Unlocked for OverclockingYesCPU SocketAM4Socket Count1PSupporting ChipsetsX570X470X370B550B450B350A520A320CPU Boost TechnologyPrecision Boost 2Instruction Setx86-64Supported ExtensionsAES, AMD-V, AVX...
CPU Compute Die (CCD) Size 180mm² Package Die Count 1 Unlocked for Overclocking Yes CPU Socket AM4 Thermal Solution (PIB) AMD Wraith Stealth Thermal Solution (MPK) AMD Wraith Stealth Max. Operating Temperature (Tjmax) 95°C Launch Date 1/8/2024 *OS Support Windows 11 - 64-Bit Edition...
CPU Compute Die (CCD) Size 178mm² Package Die Count 1 Unlocked for Overclocking Yes AMD EXPO™ Memory Overclocking Technology Yes Precision Boost Overdrive Yes Curve Optimizer Voltage Offsets Yes AMD Ryzen™ Master Support Yes CPU Socket ...
CPU Compute Die (CCD) Size 180mm² Package Die Count 1 Unlocked for Overclocking Yes CPU Socket AM4 Thermal Solution (PIB) AMD Wraith Stealth Thermal Solution (MPK) AMD Wraith Stealth Max. Operating Temperature (Tjmax) 95°C Launch Date 1/8/2024 *OS Support Windows 11 - 64-Bit Edition...
第一代Epyc采用7nm制程,利用同构方法聚合4个相同的Die,该系统可扩展,只需多个Die的互联,即可提高计算能力;第二代 Epyc将芯片功能拆分为CCD运算Die(Compute Core Die)和IO Die,通过异构方法它们集成到一起,实现了先进工艺与成熟工艺的巧妙融合。 通过高速接口和先进封装技术,把多颗Die融合在一颗大芯片内,以此来实现...
IOD die size:122mm² IOD transistor count:3.4 billion Max boost clock:5.4GHz Base clock:4.5GHz L2 cache:8MB L3 cache:32MB Memory support:DDR5-5200 (non-OC) TDP:105W Price:$399 That means we've got eight Zen 4 cores, with simultaneous multithreading delivering 16 threads of compute powe...
比如AMD Zen4架构,采用CCD(compute)和CIOD(memory interface + I/O)组合的形式进行不同Chiplets功能拆解。AMD EPYC 9004就是采用12个CDD+1个IO Die的方式,每个CDD包含12个核心,从而让9004达到了96核心的设计。 AMD利用这种设计架构获得顶级的 算力和能效,在面积与先进工艺差别不大的情况下获得成本收益。并且CCD本...
CCD die size: 70mm² CCD transistor count: 6.5 billion IOD lithography: TSMC 6nm IOD die size: 122mm² IOD transistor count: 3.4 billion Max boost clock: 5.7GHz Base clock: 4.2GHz L2 cache: 16MB L3 cache: 128MB (inc. 64MB L3D) Memory support: DDR5-5200 (non-OC) TDP: 120W Pr...
Prise off the integrated heatspreader (IHS) of a Ryzen 7000-series chip and you’ll see two or three main chips, consisting of one or two Zen 4 core complex (CCX) dies (CCD) and the input/output die (IOD). The IOD controls communication between the core dies, and between the whole...