CONSTITUTION:An in situ ingot 10 of a bar with the diameter of about tens mm is first formed as the structure dispersed with numerous Nb dendrite crystals in a raw material made of Cu or Cu-Sn alloy. An insitu element wire 11 is then formed, and the torsion with the pitch of several...
extension after treatment by a method wherein the wire rod mentioned in the title is provided with a core wire comprising copper alloy and a coating part comprising another copper alloy formed in the periphery of the core wire while the cross sectional area ratio of the coating part is ...
and Cu3+. In a natural state, copper is likely to be found in a variety of solid salts and compounds, but it can be found in the elemental form as well. Copper compounds generally are blue or green. The common green color of copper on exposure to air is a basic carbonate compound....
PVC Extruded Building Wire Machine is high speed extrusion line. And it makes the PVC, XLPE plastic compound for insulating and sheathing power cable, communication cable, magnetic wire, and so on. One and two extruders: skin/stripe process Co-extrusion: simult...
Copper compounds generally are blue or green. The common green color of copper on exposure to air is a basic carbonate compound. Copper is insoluble in water but readily dissolves in hot sulfuric and nitric acids. The vapor pressure is negligible at low temperatures, but in an industrial ...
Long-term reliability for Cu wire bonding is a major concern in replacing Au wires. Cu wires should have high reliability comparable to that of Au wires to come into practical use. The bond reliability usually depends on many factors such as related materials (pad, mold compound, wire), proc...
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Pd-coating of Cu (PCC) bond wires has been widely employed to improve the reliability of Cu wire bonding technology for microelectronics. Description of the underlying mechanism, however, is lacking in literature. We provide an interpretation of how the improvement is induced. After an un-biased...
Specifically, sulfur and titanium as the additive element contained in the soft dilute copper alloy wire and soft dilute copper alloy plate is contained as TiO, TiS or a compound having a Ti—O—S bond or an aggregate of TiO, TiO2, TiS or a compound having a Ti—O—S bond, and Ti ...
In an extrafine or ultrafine copper alloy wire having an outer diameter of not more than 0.1 mm, the copper alloy wire is formed of a heat treated copper alloy comprising 0.05 to 0.9% by weight in tot