The invention relates to a high-thermal conductivity diamond/copper composite material applicable to a wide temperature range and a method, belonging to the technical field of preparation of thermal management materials. The copper-based composite material is prepared through the following steps: ...
Kim K T,Jung W J,Choi C S.Influence of alloying elements on thermal conductivity and high temperature strength of copper based alloys.Journal of Materials Science. 2001Kim K T, Jung W J, Choi C S. Influence of Alloying Elements on Thermal Conductivity and High Temperature Strength of Copper...
Cu1.992S(Cu2SnSe4)0.004and Cu1.992SSe0.016(Cu2SnSe4)0.004bulk specimens is exhibited in Fig.4. The electrical conductivity (σ) gradually increases with temperature and then decreases after undergoing the phase transition temperature (Fig.4a), indicating that the semiconductor behavior changes to meta...
Compared with Al2O3, AlN is more expensive, but it has better mechanical and thermal performance (thermal conductivity larger than 150 W/m·K) and therefore has become popular in high-temperature applications [5]. The bottom copper layer is usually not patterned and is soldered to the ...
(λ = 1.54056 Å) at room temperature. Operando hXAS measurements were conducted at 9BM and 20BM beamlines of the Advanced Photon Source (APS, Argonne National Laboratory, Lemont, Illinois), in partnership with the Canadian Light Source (CLS) in Saskatoon (Saskatchewan). In-situ soft...
the forced convective heat transfer in a fibrous metal foam in the non-Darcy flow regime and showed that Nu was directly proportional to either the channel length based Re or the permeability based Re and that Nu depends on the porosity, pore size and thermal conductivity of the porous sample...
Selecting the optimal copper thickness in PCB design is a complex balancing act that requires thoroughly analyzing the expected current loads, thermal dissipation characteristics, manufacturability limitations, and material cost tradeoffs. Heavier copper weights with excellent current capacity and thermal perfor...
The success of this material as a HTL is due to its wide band gap (≥3.50 eV), excellent solution processability at room temperature and high hole-mobility combined with an ionization potential suitable for the efficient extraction of holes20,22. Herein, we report the findings of an ...
leading to poor mechanical and conductivity properties. Although AM using green lasers or electron beams enables the fabrication of pure Cu components with relatively high density15,16,17, the intrinsically low strength of pure Cu at room temperature and its inability to resist thermal softening hinde...
then set at room temperature under a nitrogen atmosphere. After a week, no decomposition was observed and the copper composition was suitable for liquid delivery or direct liquid injection into the CVD chamber. The 1-hexene provided a low cost stabilizer for increasing the thermal stability of the...