The preparation method of the tin-copper base lead-free solder comprises the following steps: melting tin and aluminum in a vacuum induction furnace according to the mass ratio of Sn to Al equals to 19 to 1 to prepare tin-aluminum intermediate alloy, and the melting temperature is 650 DEG ...
A copper alloy having an improved combination of yield strength and electrical conductivity consists essentially of, by weight, from 1% to 2.5% of nickel, from 0.5% to 2.0% of cobalt, with a total nickel plus cobalt content of from 1.7% to 4.3%, from 0.5% to 1.5% of silicon with a ...
If the copper seed layer has good adhesive properties to the metal nitride substrates, such as TiN, TaN, WN, etc., the adhesive properties of the later deposited copper thin film will also be good. On the other hand, if the copper seed layer has poor adhesive properties, the copper thin...
whereican take 1 and 2.\(\alpha_{i} \left( \omega \right)\)represents transmission probability from the sidei;\(1 - \alpha_{3 - i} \left( \omega \right)\)is the reflection probability from the other side. Equation (5) indicates transmission probability from side 1 (A) equals refl...
(mV s−1) while keeping the solution still. The currents were then extracted at −0.35 V versus Ag/AgCl (3 M KCl) as a function of the scan rate, leading to a slope for each sample before and after electrolysis. The slope of the plot equals capacitance of measured the ...
systems. A periodic time series was generated using the Logistic Maps (Eq.13) using α equals to 3.4. A chaotic time series was generated using the Logistic Maps (Eq.13) and α equals to 4.0. Two stochastic time series (Experimental) were generated applying a random function arrangement ...
A copper alloy having an improved combination of yield strength and electrical conductivity consists essentially of, by weight, from 1% to 2.5% of nickel, from 0.5% to 2.0% of cobalt, with a total nickel plus cobalt content of from 1.7% to 4.3%, from 0.5% to 1.5% of silicon with a ...
The value of n equals ½, 2, and 3/2 for the direct allowed, indirect allowed, and direct-forbidden transitions, respectively [68,69,70]. However, the best linear fit of the (αhν)(1/n) versus the photon energy curve was obtained for n = ½, which allows us to safely ...
According to Equation (16), when the limit of ω equals 0, M0(Cu) approaches 0, and only FeS enters the reaction system, corresponding to the smelting of pure FeS. When the slag contains FeS, the grade of matte slag is less than 80%, and the ratio of Cu to S content will be ...