The fastest and surest way to find the database entries for all copper alloys is to follow the link to ourSearch By Material Categoryand then select Metal --> Non-Ferrous --> Copper Alloy. This feature is repro
CuAgSe can be regarded as an alloy between Cu2Se and Ag2Se. Similarly, it undergoes a structural phase transition around 480 K. Owing to the superior carrier mobility [98] and the low lattice thermal conductivity, CuAgSe behaves as a potential thermoelectric material. Stoichiometric CuAgSe sho...
Alloy Copper Pipes 1 Golden Member :Copper PipesManufacturers & Suppliers Fu Tai Yi Enterprise Co., Ltd. we provide centrifugal castings, stainless steel& iron casting, lost wax casting, special machine, whole plant equipment, paddle wheel aerator, industrial speed reducers and CNC processing, oille...
www.nature.com/scientificreports OPEN On the nature of nano twin- induced shear band formation in a dispersion strengthened copper alloy under micro-mechanical loading Shadab Sarmast-Ghahfarokhi, Ali Ghatei-Kalashami, Adrian P. Gerlich, Michael J. Benoit & Y. Norman Zhou A ...
In recent years, however, there has been an increasing interest in using alloy nanoparticles in heterogenous catalysis. The reason being, the above mentioned catalysts may have low sintering resistance under reaction conditions [1]. In this regard, the use of gold‐‑copper nanoparticles has been...
In addition, copper is inexpensive in relation to (3.6 USD/lb) other metals with antibacterial properties such as silver (30 USD/lb), therefore proving to be a cost-effective material [22]. Different polymers have been used as matrices to support copper nanoparticles and generate composite ...
The nanocomposite is synthesized through the insertion of metal oxide nanoparticles (NPs) into a hydrogel matrix, optimizing the material's photocatalytic properties. The successful synthesis of the hydrogel nanocomposite was verified using X-ray diffraction (XRD), scanning electron microscopy (SEM), ...
A method for forming interconnect wiring, includes: (i) covering a surface of a connection hole penetrating through interconnect dielectric layers formed on a substrate for interconnect wiring, with an underlying alloy layer selected from the group consisting of an alloy film containing ruthenium (Ru...
Cu 110 (99.9%+ Cu) alloy specimens were used for instrumented compression molding experiment. The equal-channel angular pressing (ECAP) method was employed for grain refinement through a custom designed and built device. Cu specimens after ECAP processing were vacuum annealed under different conditions...