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The reliability of packaged laser diodes is heavily dependent on the quality of the die attach. Even a small void or delamination may result in a sudden increase in junction temperature, eventually leading to failure of the operation. The contact thermal
SEM and Digital Microscope The evaluation of the microstructure and morphology of carbon fibers and C/C com- posites was performed using Nova NanoSEM 200 (FEI Europe Company, Eindhoven, The Netherlands) scanning electron microscope and Thermo Fisher Scientific (Waltham, MA, USA) SCIOS II Dual ...