As consumer microelectronics become ever more ubiquitous, there are growing concerns about their environmental impact. However, the diversity of designs and components used in modern devices makes a coherent mitigation strategy hard to formulate. In this
(1) Desoldering process For desoldering ICs from WPCBs, there are three main options; removal via (1) mechanical grinding of solder joints on the rear of the PCB; (2) removal via chemical separation; or (3) thermal removal of the solder via infrared heaters, hot air, supercritical ...