The present invention relates to processes for the construction of semiconductor lasers.The process according to the invention is essentially characterized in that it consists in forming a layer 1 of a laser semiconductor active medium, in forming an optical cavity 2 associated with this layer, in ...
The present invention relates to processes for the construction of semiconductor lasers.The process according to the invention is essentially characterized in that it consists in forming a layer 1 of a laser semiconductor active medium, in forming an optical cavity 2 associated with this layer, in ...
Semiconductor lasers have been the necessities of information infrastructure such as optical fiber communication and information storage. During the recent ten years, great progress has been made in China in the construction of her information infrastructure. As a basic component, semiconductor laser has...
4. Send and receive There are two types of light sources that can be used as signal sources: light-emitting diode (LED) and semiconductor laser (injection laser). They have different properties, as shown in the following table. The project data rate model is the cost of life temperature ...
However, the increasingly versatile and high-end application demands have significantly complicated the design of functional devices, which is sometimes difficult to realize solely based on the intrinsic physical and semiconductor properties9. In this case, core–shell heterostructure NWs have been ...
Gallium is a strategic metal used today to manufacture compound semiconductor wafers used in integrated circuits, and optoelectronic devices such as laser diodes, light-emitting diodes, photodetectors, and solar cells. Kipushi concentrator continues ramp-up...
A dense semiconductor flip-chip device assembly is provided with a heat sink/spreading/dissipating member which is formed as a paddle of a metallic paddle frame in a strip of paddle frames. Dice are bonded to the paddles by e.g. conventi... DJ Corisis - US 被引量: 9发表: 2003年 ...
OYAMA, Japan--(BUSINESS WIRE)--Gigaphoton Inc.(Head Office: Oyama, Tochigi; President and CEO: Katsumi Uranaka), a manufacturer of lightsources used in semiconductor lithography, has announced that it will increase its production capacity by 2.5 times through the construction of the new building...
CONSTITUTION:A recess 1a is shaped on a substrate 1 by laser scribing etc. Positioning dummy chips 4 are bonded to the back surface of an LED device 2 using the first conductive paste 5. The dummy chips are shaped from a conductive material with proper configuration, dimension and accuracy,...
Various configurations of light emitting semiconductor chips and heat sinks are disclosed, as well as various structures and methods for driving, controlling and... D Cao - US 被引量: 29发表: 2005年 Instrumentation and manufacture of a smart composite bridge for short-span applications A smart ...