PURPOSE: An epoxy resin composition and a flame retardant copper thin laminated plate prepared by using the composition are provided to reduce permittivity and to improve thermal characteristic. CONSTITUTION: The epoxy resin composition comprises 100 parts by weight of a brominated epoxy resin containing...
PURPOSE: Provided is an epoxy resin composition for a fire-retardant copper foil-laminated plate used for a PCB(printed circuit board), which has a low dielectric constant and high heat-resistance. CONSTITUTION: The epoxy resin composition contains: 100pts.wt. of a brominated epoxy resin containi...
摘要: Composition of epoxy resin curable adhesive, process for preparing a composition of epoxy resin adhesive curable and two or more substrates.The present invention relates to an epoxy resin composition收藏 引用 批量引用 报错 分享 全部来源 求助全文 掌桥科研 相似文献...
(3:1, v/v) and 100% acetone for 17 min, respectively. Repeat the dehydration step again in 100% acetone. Then infiltrated through a graded acetone/Epon/Spurr’s epoxy resin and polymerized at 70 °C for 24 h, the polymerized blocks were sectioned on a Leica Ultracut UCT ...
Epoxy resin composition for encapsulation of semiconductor device 57 There is disclosed an epoxy resin composition for encapsulation of semiconductor device, which comprises the components (a), (b), (c) and at least one of the components (d) and (e) as shown below Yoshizumi Akira c/o K.K...
PURPOSE:To provide the titled composition moldable without forming clouding on the surface of the mold, by compounding an epoxy resin with a small amount of an alkaline earth metal hydroxide. CONSTITUTION:The objective composition can be produced by compounding (A) a composition containing an epoxy...
WIPO Patent WO/1994/010241A1 Note: If you have problems viewing the PDF, please make sure you have the latest version ofAdobe Acrobat. Back to full text
An object of the present invention is to provide an epoxy resin that can be easily produced, can easily achieve a molecule-aligned state, and can be cured to provide a cured material with optical anisotropy and excellent toughness and thermal conductivity. The epoxy resin of the present inventio...
PURPOSE:The titled composition that contains an epoxy resin, a polyfunctional phenolic resin, a triazole or indazole derivative and a curing accelerator, thus showing high adhesion to metal and good drilling processability, when it is used as a material for printed circuit boards. CONSTITUTION:The ...
摘要: PURPOSE: To obtain an epoxy resin composition for CFRP having low viscosity, excellent curability and excellent stability of viscosity and having a good balance between elongation and heat resistance when cured.收藏 引用 批量引用 报错 分享 ...