An apparatus for performing chemical mechanical polish on a wafer includes a polishing head that includes a retaining ring. The polishing head is configured to hold the wafer in the retaining ring. The retaining ring includes a first ring having a first hardness, and a second ring encircled by...
CMP pads are critical in the CMP process to flatten and polish wafers and can have a significant impact on process performance. Our CMP pad solutions are manufactured using state-of-the-art polyurethane chemistry and engineering advances to provide the exact hardness, pore sizes, compressibility, ...
经生产验证,采用该方法可提升工作效率,减少校准误差,提高压力校准精度。关键词:化学机械抛光;自动压力校准;高精度压力检测仪 中图分类号:TN305文献标志码:B 文章编号:1004-4507(2020)04-0047-03Research and Application of CMP Polish Head Zone Pressure Auto Calibration Method JIA Ruoyu ，BAI Kun ，MENG Xiao...
IntroductionofCMP CMP发展史 •1983:CMP制程由IBM发明。•1986:氧化硅CMP（Oxide-CMP）开始试行。•1988:金属钨CMP（WCMP）试行。•1992:CMP开始出现在SIARoadmap。•1994:台湾的半导体生产厂第一次开始将化学机械研磨 应用于生产中。•1998:IBM首次使用铜制程CMP。SMIC IntroductionofCMP CMP制程的全貌简介...
S MI CPOLY CMP流程简介-2aFOXFOXCellP2P2P2FOXFOXCellP2P2P2FOXPOLY DEPOPOLY CMP + OVER POLISH功能:长POLY膜以填之。功能:刨平POLY 9、膜。END POINT(终点)探测界限+OVER POLISH(多出研磨)残留的POLY膜。 S MI CROUGH POLY CMP 流程-2bCELL ARRAY CROSS SECTIONFOXFOXCellP2P2P2CELL ARRAY CROSS ...
,.,POLY CMP流程简介-2a,POLY DEPO,POLY CMP + OVER POLISH,功能:长POLY膜以填之。,功能:刨平POLY 膜。END POINT(终点)探测界限+OVER POLISH(多出研磨)残留的POLY膜。,.,ROUGH POLY CMP 流程-2b,P 8、R COATING,功能:PR 填入糟沟以保护糟沟内的ROUGH POLY。,ROUGH POLY CMP,功能:刨平PR和ROUGH POLY...
Entrepix is the leader in semiconductor engineered products and CMP semiconductor equipment. We offer the all new OnTrak DSS-200 cleaner and refurbish OnTrak, IPEC, and AMAT Mirra, Mirra Mesa, Reflexion, Strasbaugh systems. The Entrepix Foundry handle
SMIC IntroductionofCMP CMP发展史 •••••1983:CMP制程由IBM发明。1986:氧化硅CMP（Oxide-CMP）开始试行。1988:金属钨CMP（WCMP）试行。1992:CMP开始出现在SIARoadmap。1994:台湾的半导体生产厂第一次开始将化学机械研磨应用于生产中。•1998:IBM首次使用铜制程CMP。SMIC IntroductionofCMP CMP制程的全貌...
IntroductionofCMP CMP发展史 •1983:CMP制程由IBM发明。•1986:氧化硅CMP（Oxide-CMP）开始试行。•1988:金属钨CMP（WCMP）试行。•1992:CMP开始出现在SIARoadmap。•1994:台湾的半导体生产厂第一次开始将化学机械研磨 应用于生产中。•1998:IBM首次使用铜制程CMP。SMIC IntroductionofCMP CMP制程的全貌简介...
46、ustin.cc.tx.us/HongXiao/Book.htm80Orbital PolishingDown ForceSlurryWaferCarrier FilmwcOrbital Motion, wpPolish PadHong Xiao, Ph. D.www2.austin.cc.tx.us/HongXiao/Book.htm81Polishing Pad Porous, flexible polymer material cast, sliced polyurethane or urethane coated polyester felt Pad directly...