The present invention relates to a package for a semiconductor device. 为了防止在半导体元件与安装半导体元件的半导体封装之间的接合部分中出现应力,以使即使在安装具有小的强度的半导体元件时也不发生碎裂. In order to prevent the semiconductor element and the semiconductor element mounting package in a joint...
Method for amplifying image using interpolate point technology and use thereof本发明提供一种利用插补点技术放大原始影像的方法及其应用在数字相机. The invention provides a technique using the interpolation points of the original image amplification method and its application in a digital camera. 该方法包含...
Composite point to point comparative supplementary interpolate method and system software thereofThe interpolation by composite point by point comparative supplementary method and its system software are a kind of supplementary interpolating operation and logical control method and system software in the ...
Clock data recovery (cdr) phase walk scheme in a phase-interpolater-based transceiver systemMethods and apparatus are described for synchronously stepping at least one of a data phase interpolator (PI) code (306) or a crossing PI code (308) in a clock and data recovery (CDR) circuit (206...