像素的种类可以是非常多的,比如可见光最常用的就是3T,4T,5T像素,如果还要加入更多的功能,比如全局快门(GS,Global Shutter),高动态(HDR,High Dynamic Range)等就要加入更多的晶体管;X光用于做Photon Counting的CTIA-based pixel;用于Event sensor的DVS pixel;用于3D成像的常作dToF(direct time-of-flight)的SPAD像素...
像素的横截面示意图 (a) 控制像素; (b)串扰改善像素。 Wafer Level Quantum Efficiency Spectrum of two different structure CISs. 在该图中,展示了0.9um像素的量子效率光谱,其中虚线代表控制的0.9um像素(a),实线代表改进的0.9um像素(b)。由于栅格结构的光学孔径面积略微变小,因此光学串扰得到了极大的抑制。光学...
SuperPix Micro Technology, since 2004Color filterlCMOS Sensor structure: pixel a 3、rray +peripherySuperPix Micro Technology, since 2004Color Patternn Black&White sensor: pixel without colorn Color sensor: pixel with color(RAW data: each pixel with gray value;YUV data: raw data with ...
recently announced SC850AT, an 8.3-MegaPixel (MP) automotive-grade CMOS Image Sensor (CIS), as the latest solution of SmartSens’ Automotive Sensor (AT) Series. Using SmartSens’ proprietary technologies including SmartClarity
数据来源:三星官网,西南证券整理 ISOCELL Fast 采用双PD和超级PD实现更快速的AF3层堆叠快速读出 传感器.借助Dual Pixel和超级PD(Super PD)传感器等 先进的相位检测自动对焦(PDAF),ISOCELL fast 传感 器即使在弱光环境下也可以识别快速移动物体的距离, 从而实现更快速,更准确的自动对焦.3层堆叠,快速 读出传感器...
数据来源:三星官网,西南证券整理 ISOCELL Fast 采用双PD和超级PD实现更快速的AF3层堆叠快速读出 传感器.借助Dual Pixel和超级PD(Super PD)传感器等 先进的相位检测自动对焦(PDAF),ISOCELL fast 传感 器即使在弱光环境下也可以识别快速移动物体的距离, 从而实现更快速,更准确的自动对焦.3层堆叠,快速 读出传感器...
白像素数量(WhitePixel)是评价CIS器件性能的关键参数之一。而造成白像素的主要原因是器件制造过程所受到的金属杂质污染,所以降低工艺过程中的金属杂质污染可以明显改善CIS器件的白像素问题。目前10 业界用来降低硅片中金属杂质的方法分为内部吸附和外部吸附这两大类。本文采用内部吸附中的释放机制,通过增加一道退火工艺来...
A CMOS image sensor structure includes a substrate and pixel portions. Each pixel portion includes intersection areas, the border areas each of which is located between any two adjacent ones of the intersection areas, and a central area surrounded by the intersection areas and the border areas. ...
Sensor结构（二）On-chipmicrolens能增加每一个pixel的受光面积。Colorfilter让每个Pixel只接受红/绿/蓝其中一种颜色的光。Electronicslayer吸收穿过colorfilter的光子，再根据其所吸收的光子多少转换成大小不同的电流。SuperPixMicroTechnology,since2004 Colorfilter CMOSSensorstructure:pixelarray+periphery S...
It’s a 23MP image sensor with a 1um x 1um pixel size that uses a new hybrid bonding structure (while the conventional structures are TSV like). Sony also announced its first three-layer, 960 fps camera with Sandwich-Stacked DRAM in May 2017. Fig. 8: Sony 3 stacked layer CIS Device...