This reliability test is performed on electronic assemblies that erect the presence of ionic contaminants. The presence of ions can impact the reliability and performance of the assembly. The major purpose of this test is to ensure the board is free from ionic contaminations, as it can cause el...
20110008974CIRCUIT DESIGN ASSEMBLIESJanuary, 2011Salomie Primary Examiner: SIEK, VUTHE Attorney, Agent or Firm: MEITAR PATENTS LTD. (Ramat-Gan, IL) Claims: 1.An integrated circuit, comprising:a target circuit on a chip; andan embedded agent on the chip, including:a signal collector configured ...
Circuit board assemblies for space applications have typically been constructed using leaded metal or ceramic packages. The metal or ceramic packages provide hermeticity and some measure of protection against radiation for the packaged integratedcircuits. The leads of these packages provide stress relieved ...
Organization of cell assemblies in the hippocampus. Nature 424, 552–556 (2003). CAS PubMed Google Scholar Börgers, C., Epstein, S. & Kopell, N. J. Gamma oscillations mediate stimulus competition and attentional selection in a cortical network model. Proc. Natl Acad. Sci. USA 105, ...
A circuit board comprises signaling through-holes that pass through a plurality of layers, including signal trace and digital ground plane layers, and power reference plane layers. Clearances are set
To examine whether these manipulations reduced the ability of the CA1 region to form assemblies or whether different assemblies were formed, we identified assemblies independently during baseline and stimulation trials. There was no change in the number of assemblies or the fraction of highly ...
The present application is a continuation-in-part of U.S. patent application Ser. No. 17/308,807, filed on May 5, 2021, entitled “Systems, Methods, and Devices for Networking Cable Assemblies” the entire disclosure of which is hereby incorporated herein by reference, in its entirety, for...
Circuit assembly materials are plated, etched, handled by operators in assembly, coated with corrosive or potentially corrosive fluxes and finally soldered. In the fabrication of electronic circuit assemblies, e.g., printed circuit boards, soldering fluxes are first applied to the substrate board ...