Remove the fixation solution by spinning down at 500xg at 4°C for 5 minutes. To quench the reaction, for cell count of 1-5 million, add 3mL of 0.65M glycine solution; for cell count of 5-10 million, add 4mL of 0.65M glycine solution; for cell count of 10-15 million, add 5mL ...
The supernatant was discarded and the cell pellet was rinsed with 1× PBS by spinning at 1800 rpm for 5 min. The chondrocytes obtained as cell pellets were suspended in H-DMEM containing FBS (10%), L-ascorbic acid (50 µg mL−1), dexamethasone (1 mM), TGFβ-2 (50 ...
Of course, the background and history of a firm like ASML, which is much less in the news compared to TSMC, and how they’ve spent more than three decades perfecting the art of lithography after spinning out of Phillips is just amazing. The whole explanation that Chris provided as to ...
Live imaging benefits from the high-speed resonant scanner featured on the AX R model, which allows for fast imaging with up to 2048 x 2048-pixel resolution across the entire 25 mm FOV. The Yokogawa CSU-W1 spinning disk confocal system is also suited to imaging various types of 3D cell ...
This is easily accomplished in a centrifuge fitted with adaptors for spinning microtiter plates. Place a standard 96-well plate in the adaptor to hold the tubes in place. Be sure to balance the rotor (i.e. place a microtiter plate and tubes of appro- priate mass in the rotor's opposing...
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RPET fabric recycled fiber raw coke bottle recycling, the coke bottle rolling recovery into pieces after silking, after processing, can be recycled and reduce carbon dioxide emissions, save nearly 80% of energy than conventional process for the prod...
Spinning out a company has been the best way to validate the technology — especially with novel power-electronics hardware, Dawson says. “People in our industry take ideas a lot more seriously when there’s a company behind it,” he says. “We had impressive performance at MIT, but now ...
For formation of more than one metal layer, the process of spinning on a dielectric, forming via holes, metallization and photoimaging is repeated. The Build-up process is commonly utilized in the printed circuit and chip packaging manufacturing arenas for multilayer interconnects and is now being...
As shown inFIG. 6an etch mask57is applied to mask the solder bump area. The etch mask is preferably a conventional photoresist and is formed by spinning photoresist on the surface layer and patterning the photoresist with suitable actinic radiation.FIG. 6shows the developed photomask. Alternative...