CHIP ON WAFER BONDER 来自 百度文库 喜欢 0 阅读量: 42 申请(专利)号: US20080054097 申请日期: 2008-03-24 公开/公告号: US2009142903A1 公开/公告日期: 2009-06-04 申请(专利权)人: CHEN-HUA YU;JUI-PIN HUNG;WENG-JIN WU;JEAN WANG;WEN-CHIH CHIOU 发明人:...
The present invention provides a chip-wafer bonder, comprising a cleaning module designed for cleaning chips; and a chip-to-wafer bonding chamber configured to receive the chips from the cleaning module and designed for bonding the chips to a wafer. The present invention also provides a chip-to...
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Hence it is critical that good chip placement accuracy is needed in the flip-chip bonder for good solder interconnect formation especially for our work in the new RDL-first FOWLP technology with multiple die and high pin count applications [5]. In this paper, we present the chip to wafer ...
FlipChipBonder特点:Chip-to-WaferFlipchipbonderforNCF-TCBprocessCapableofhigh-speed详细介绍 Flip Chip Bonder特点: Chip-to-Wafer Flip chip bonder for NCF-TCB process Capable of high-speed, high-precision flip chip bonding by adopting probe camera technology and linear motor High precision control ...
1.13). The interposer generally consists of a metallized, flexible polyimide tape on which are formed electrical connections by photolithographic processes. As a final step, the exposed wire bonds and edges of the chip are molded with epoxy. Wafer-level CSPs. CSPs can be batch fabricated at ...
LED waferandchipmanufacturing, powerpackage,applications development, pilot and production, product testing to the market circulation of semiconductor lighting the whole industry chain, will form the next 3-5 years 30 billion to 500 billion industry,size,andbecome well-known ...
1.13). The interposer generally consists of a metallized, flexible polyimide tape on which are formed electrical connections by photolithographic processes. As a final step, the exposed wire bonds and edges of the chip are molded with epoxy. Wafer-level CSPs. CSPs can be batch fabricated at ...
To finish the encapsulation process, further deposition is done on the die’s edges. Among the many functions of the underfill material is to improve mechanical strength and dependability. Integration with Advanced Packaging Solutions Wafer-level Packaging – Wafer Level Packaging is the art of ...