芯片封装:指把硅片上的电路管脚,用导线接引到外部接头处,以便与其它器件连接。 Chip Package:The housing that chips come in for plugging into (socket mount) or soldering onto (surface mount) the printed circuit board. Creating a mounting for a chip might seem trivial to the uninitiated, but chip ...
The present invention relates to a chip on board module, comprising: a heat diffusion member having a lower plate, a lower wick, a vapor spacer, an upper wick and an upper plate, wherein the lower wick, the vapor spacer and the upper wick are closely coupled in a space sealed between ...
A CPU chip-on-board module for low and midrange computers is described. The module consists of a CPU bare chip, 24 SRAM's packaged in SOJ packages, and some decoupling capacitors. The module substrate is a printed circuit board (PCB) made of bismaleimide-triazine resin. The module (156 mm...
The invention relates to a COB (Chip on Board) LED module and a manufacturing method thereof. The COB LED module comprises a substrate, an LED chip and a BT (Bismaleimide Triazine) layer which are arranged on the substrate, and a fluorescent glue layer covering on the LED chip by using ...
The invention relates to an onboard chip module (200) which comprises a circuit board frame (210) and a chip (220), wherein the circuit board frame (210) is provided with a hollow first area (211), first and second bonding pads (213 and 214) and first and second surfaces (215 and...
A computer-aided, spatially-selective protection technique for multichip module and chip-on-board devices The use of a precise computer-controlled dispensing system to fashion medium-modulus, very thin silicone dams around the interconnection area of IC devices... Mann,W J. - Electronic Components...
Device and method for electrically or thermally coupling to the backsides of integrated circuit dice in chip-on-board applications... S Akram 被引量: 0发表: 2002年 Chip-on-board display module, manufacturing method thereof, light-emitting diode device and manufacturing method thereof Chip-on-boar...
100 Gbps (4 × 25 Gbps) optical receiver (Rx) module is demonstrated using Germanium (Ge) photodetector (PD) which is fabricated through Silicon-photonics process using 750 ohm-cm of high-resistivity silicon oxide insulator (SOI) wafer. Trans-impedance amplifier (TIA) and Ge PD are packaged ...
Character LCD Modules Cog (Chip On Glass) COB (Chip On Board), Find Details and Price about LCD Screen Module LCD Character Module LCD from Character LCD Modules Cog (Chip On Glass) COB (Chip On Board) - Royal Display Co., Ltd.
DUAL-INLINE-MEMORY-MODULE MOUNTED STACK BOARD-ON-CHIP PACKAGES WITH MIRRORING STRUCTURE Embodiments of the invention include a stacked board-on-chip (BOC) package having a mirroring structure and a dual inline memory module (DIMM) on which the... DH Kim,BS So,JH Cho,... 被引量: 0发表:...