Japanese will pay with cell phones on credit with planned mobile service
Heir, G. Design of a 3D Printed Modular Assembly Kit for Mobile Phones. Bachelor’s Thesis, Escola Tècnica Superior d’Enginyeria Industrial de Barcelona, Barcelona, Spain, 2021. Available online:https://upcommons.upc.edu/bitstream/handle/2117/353137/memoriatfg-gabrielgutierrez.pdf?sequence=1&is...