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Ethanol from the CO2conversion is much more difficult than MeOH due to the C-C chain formation. Wanget al. used Au/TiO2catalyst to generate EtOH at 200 °C and 60 bar from CO2and H220or from a reverse water-gas shift reaction, while most reactions were executed above 250 °C a...
芯片打线邦定电路板加工 COB Bonding DIE键合PCB镀金线路板生产,Lingzhi Electric Circuit (Shenzhen) Co., Ltd供应各类电路板加工定做。 领智电路(深圳)有限公司成立于2017年,是一家为高科技企业及科研单位提供PCB打样及批量加工厂家,致力于2-16层高精密PCB线路板及软硬结合板研发制造。主要生产PCB多层板、PCB高频板...
Chip-to-Wafer assembly is a promising technology for high density package application to overcome the limitation of Wafer-to-Wafer boding in terms of die stacking process yield and bonding placement accuracy on wafers. Our test vehicle is a large multi-chip package of 20x20mm2 fabricated using ...
The binding energies and electronic properties of substituted fullerenes ${\mathrm{C}}_{58}$${\mathrm{B}}_{2}$ and ${\mathrm{C}}_{58}$${\mathrm{N}}_{2}$ have been calculated by a self-consistent-field molecular-orbital (MO) method; their structures are optimized by a MO method ...
Bonding and Magnetism in High Symmetry Nano-Sized Graphene Molecules: Linear Acenes C4m+2H2m+4 (m=2,…25); Zigzag Hexangulenes C6m**2H6m (m=2,…10); Crenelated Hexangulenes C6(3m**23m+1)H6(2m1) (m=2,…6); Zigzag Triangulenes Cm**2+4m+1H6... Bonding and Magnetism in Hi...
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We propose a novel hybrid bonding technology with a high stacking yield using ultra-high density Cu nano-pillar (CNP) for exascale 2.5D/3D integration. To solve the critical issues of current standard hybrid bonding technology, we developed scaled electrodes with slightly extruded structure and uniq...
et al. Enantioselective excited-state photoreactions controlled by a chiral hydrogen-bonding iridium sensitizer. J. Am. Chem. Soc. 139, 17186–17192 (2017). Article CAS Google Scholar Li, Y. et al. Copper(ii)-catalyzed asymmetric photoredox reactions: enantioselective alkylation of imines driven...
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