Bosch’s proprietary APSM (Advanced Porous Silicon Membrane) MEMS manufacturing process is fully CMOS compatible and allows a hermetic sealing of the cavity in an all silicon process. The BMP280 is based on Bosch’s proven Piezo-resistive pressure sensor technology featuring high EMC robustness, ...
Bosch’s proprietary APSM (Advanced Porous Silicon Membrane) MEMS manufacturing process is fully CMOS compatible and allows a hermetic sealing of the cavity in an all silicon process. The BMP280 is based on Bosch’s proven Piezo-resistive pressure sensor technology featuring high EMC robustness, ...
Publication of the Netherlands Institute of Bankers and Stock Brokers
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