Difference in term of ball bond deformation eventually lead to distinctive ball shear respond and process parameter window on concave bond pad. Wire pull test and ball bond cross section analysis also included in this study to complete the evaluation. ...
(1) adjusting bonding process parameters to minimize the thermal and/or mechanical shock to the bond pad; and (2) optimizing the barrier metal layer materials and deposition technology. These efforts have met with only partial success, and impose undesirable constraints (i.e., a narrow window ...
This study uses harsh wafer probing to compare cracking tendencies for various pad structures having slots or holes in the metal sub-layers directly beneath the pad window. The presence of a full sheet of metal in a pad sub-layer will dominate the top SiO2 cracking performance in the pad. ...
at least a portion of which are disposed within a cross-sectional area of the device defined by a periphery of the bonding pad window. In a preferred embodiment, the feature includes an array of metal-filled recesses, which are arranged to intersect one another, forming a plurality of discret...
The first set of vias having at least two line vias extending in a first direction toward the second set of vias having at least two linear dielectric layers different from the first direction toward a second direction extending window. 第一介层窗组的线型介层窗不与第二介层窗组的线型介层窗...
Orthogonal response surface methodology (RSM) experiment design was adopted in defining the critical optimum process window for robust Cu bonding both process-ability and reliability. 43µm Cu bonding qualification on very thin bond pad of 1.4µm Al thickness without pad damage and obtain mi...
Weld area (394,106) and the lands window (62,108) made into the welding zone window (62,108) asymmetry in the weld zone (394,106) of the conductive zone (398,106). 如果焊接区更可能从焊接区(394,106)的刻划线一侧剥离,则焊接区窗口(62,108)制作成使钝化层(52)覆盖更多的靠近刻划线(40)...
The etch is performed using only a single mask. The fuse opening defines a fuse window. The upper surface of the bond pad is exposed by substantially removing the coating from the entire upper surface.TAI-I YANGMARCUS YANGCHIH-HAO LINHONG-SENG SHUERUEI-HUNG JANG...
Finally a third dielectric layer6(whis is also referred to as the “dielectric-3”, or “top dielectric,” layer) is deposited on the dielectric-2layer3using a photolithography technique leaving a bond pad window, within which the metal bond pad layer5(which is also referred as the “metal...
The etch is performed using only a single mask. The fuse opening defines a fuse window. The upper surface of the bond pad is exposed by substantially removing the coating from the entire upper surface.Tai-I YangMarcus YangChih-Hao LinHong-Seng ShueRuei-Hung Jang...