必应词典为您提供bonding-pad的释义,un. 焊盘;结合区;焊接点; 网络释义: 压焊垫;
bonding pad的中文意思 沪江词库精选bonding pad是什么意思、英语单词推荐 结合片,结合区,连接区 相似短语 bonding pad结合片,结合区,连接区 pad it步行,徒步行走 on the pad在路上,在流浪;拦路抢劫;受贿 bonding agent结合剂,保税授信机构,键合剂 bonding land接合区...
The bonding pad adopts the Immersion Au Process, components contact well and low loss,the signal transmitted through the [...] en.cytech.net.cn 焊盘采用沉金工艺处理,器件接触好 损耗小,信号的传输在铜层不会对信号有影响,具有良好的散热和电气性能. cn.cytech.net.cn Heraeus AlSi:Bond roll ...
bonding pad 英文bonding pad 中文【计】 焊接区
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bonding pad 结合区[片]
To avoid this problem, the effective bonding pad sizes and spacing must be reduced . 为了避免这个问题,有效的键合压脚尺寸和间距都必须减少。To achieve the required bump heights , the solder paste is over - printed onto the wafer bond pads 为了获得要求的凸起高度,锡膏在晶片...
BONDING PADPURPOSE: To improve a bonding pad so as to prevent the probe deviation of a probe from being generated when the test of the electrical characteristics of a semiconductor device is made using a prober.OSHIGE RYUICHIRO大重 隆一郎...
The near edge of abonding padshould never be closer to any component or package wall than the height of that component. Bonding Pads and Package Pins. Bonding pads to be interconnected to the output pins of the package should always be placed on the perimeter of the circuit substrates. ...
焊盘尺寸Bonding pad size.PDF,焊盘尺寸Bonding pad size SMAX(DO-214AC) SMAG(DO-214AC) 1.92 1.82 2.40 1.65 2.56 1.43 6.45 6.55 U nit :mm U nit :mm SMBX(DO-214AA) SMBG(DO-214AA) 2.16 2.36 2.30 2.44 2.44 1.84 7.04 6.72 U nit :mm U nit :mm 1 焊盘尺寸Bonding pa