Bond-line thicknessdie tiltstereo visionlinear CCDThis study focuses upon building an automated inspection system for the in-line measurement of bond-line thickness (BLT) and die tilt in die attachments in the semiconductor packaging process. A prototype of a visual system utilizing the line scan ...
Today, the demands for smaller packages require highly reliable thermal coupling to associated packages. Therefore, bondline thickness must be carefully controlled.Hybond Inc.’s patented bond-line thickness measurement and die placement technologyis incorporated on its model EDB-141 die bonder...
This includes the schematic for a lap-shear sample test rig and consideration for controlled variation of the bond-line thickness for up to ten pairs of samples at a time. Concerns regarding the curing of the samples when held on a large heat reservoir are addressed through direct measurement ...
this will be done at different positions along both the visible sides of the joint. Accuracy is important as the small thickness of the bondline increases the significance of any measurement uncertainty, for example an accuracy of 0.1mm in the measurement is equivalent to a relatively high uncert...
BondlineThicknessBondlinethickness(b)ThicknessoftheEpoxy--measuredfromtheLFtothebottomofdieConditionofreject:boutoftherange10.5milInspectionMethod:MeasurementusingHisometmicroscope(200X)ExampleofBLTResultDiesize:25milx25milDiethickness:9milLeadframe:SOT23-3LCommonProblems&PossibleCausesBondlineThickness-con’tInade...
An underfill composition for encapsulating a bond line and a method of using the underfill composition are described. Advantageously, the disclosed underfill composition in an uncured state has a fluidity value of less than about ten minutes over about a two centimeter distance at a temperature of ...
measurement of haftstaerke composite fuellprodukte. The invention is a method for the on-line nondestructive determination of the internal bond strength of composite panel products. The method involves impin... M Shearer,C Beetham,C Beall,... 被引量: 0发表: 1992年 加载更多研究...
An ultrasonic nondestructive technique for the quantitative determination of the cohesive properties of adhesive joints based on the measurement of the reflection coefficient from the top adhesive/adherend interface and the bondline transit time has been developed. The method requires access to only one...
and film adhesives to meet challenging requirements. This has helped make important contributions for medical monitoring device manufacturers to produce lightweight, mobile, energy efficient, multi-functional, wireless monitors for fast, remote network integration. Measurement of key patient parameters through...
This mid-IR beam size decides the chemical imaging FOV for a single wide-field measurement and is sufficiently large for encompassing single cells. For larger objects, such as C. elegans, we extend this FOV by scanning the mid-IR beam and stitching the chemical imaging information ...