Datacon 2200 evo plus The Datacon 2200 evo plus die bonder for Multi Module Attach assembles all kinds of technologies on a tried-and-tested platform, enhanced with key features for higher bonding accuracy and lower cost-of-ownership. Besides unbeaten flexibility and full customization possibilities...
Datacon 2200 evoplus Datacon 2200 evohF Datacon 2200 evohS Datacon 2200 evoadvanced Die Bonding Esec 2100 hSix Esec 2100 sDadvancedi Esec 2100 hSi Esec 2100 hS Esec 2100 SC Strip Mapping E142 on Esec Die Bonder Soft Solder Die Bonding ...
Besi Datacon 2200 evo plus 粘片机 【导读】BesiDatacon2200evoplus粘片机TheDatacon2200evoplusdiebonderforMultiModuleAttachassemblesallkin... BesiDatacon2200evoplus粘片机 TheDatacon2200evoplusdiebonderforMultiModuleAttachassemblesallkindsoftechnologiesonatried-and-testedplatform,enhancedwithkeyfeaturesforhigherbo...
Besi Datacon 2200 evo plus 粘片机 The Datacon 2200 evoplus die bonder for Multi Module Attach assembles all kinds of technologies on a tried-and-tested platform, enhanced with key features for higher bonding accuracy and lower cost-of-ownership. Besides unbeaten flexibility and full customization...
BesiDatacon2200evo粘片机 TheDatacon2200evohigh-accuracymulti-chipdiebonderprovidestheultimateflexibilityfordieattachaswellasforflipchipapplications.Equippedwithintegrateddispenser,12”waferhand领,automatictoolchanger,andapplicationspecifictoo领,theDatacon2200evoispreparedforpresentandfutureprocessesandproducts. ...
6 敬请关注文后特别声明与免责条款 s 图表 7:Besi 全球化布局 集成电路封测 行业深度报告 资料来源:Besi 官网,方正证券研究所 2 产品矩阵完善,涵盖固晶+塑封/电镀设备 多款产品覆盖封装领域.固晶机领域,2200(evo-advanced)凭借全新的龙门架 和控制器系统以及全新的视觉系统,提供卓越的 3μm 贴装精度的同时保证...
分化为面向先进封装提供有多模块连接产品Datacon 2200 evo系列、固晶贴装产品有Esec2100系列;面向大规模生产和高端领域提供倒装芯片系统产品有Datacon 8800系列(Datacon 8800 TC有先进的 TC-CUF 良率控制,实现精度±2μm,Datacon 8800 CHAMEO适用于细间距和 TSV 应用,实现精度±3~5μm;Datacon QUANTUM适用于多功能...
固晶机领域,2200(evo-advanced)凭借全新的龙门架 和控制器系统以及全新的视觉系统,提供卓越的 3μm 贴装精度的同时保证 2500-7000UPH。注塑机领域,Fico AMS-LM 可以处理最大尺寸为 102 x 280 毫米 的基板,并能处理所有当前的单面和双面封装。剪切与成型机领域,FCL-X 压机 具有增强的压力,可处理极高密度的...
Datacon 2200 evo advanced More information Datacon 8800 FC QUANTUM advanced More information Datacon 2200 evo plus More information Datacon 8800 CHAMEO advanced More information Datacon 2200 evo More information Datacon 2200 evo hS More information Esec 2100 hS ix More information Esec 2100 ...
Datacon 2200 evoplus Datacon 2200 evohF Datacon 2200 evohS Datacon 2200 evoadvanced Die Bonding Esec 2100 hSix Esec 2100 sDadvancedi Esec 2100 hSi Esec 2100 hS Esec 2100 SC Strip Mapping E142 on Esec Die Bonder Soft Solder Die Bonding ...