BAV70S/DG/B2 with EDA / CAD Models manufactured by NXP. The BAV70S/DG/B2 is available in SOT-363 Package, is part of the IC Chips. 技术参数 制造商 CYS 包装 Tape & Reel (TR)/Cut Tape (CT)/Tray/Tube RoHs Status Lead free / RoHS Compliant 封装/规格 SOT-323 BAV70S3...
R5F56609DGFN#10 & R5F56609DGFN#30 & R5F566TEEGFN#30 & ¥[1_7ij1w4tp#51#QEBAQE0XNw6zFCkb8iHmFnwa7RcAF60bHxGDGqMeTh8EEzYauh1MFqMSjh0VDhMSbhQKIOMT8xa0DzshER97GkEgbhVvECAa2Q+fFwca2Q8DE3AZCB2QHqkfBBVzHU0ZuhQKF5QWlBPm] MAX3485ECPA+ & MAX3488ECPA+ & SN65LV1224BDBR & 原装...