FEOL和BEOL是集成电路制造中的两个关键阶段,它们的目标、技术手段和挑战各不相同,却又密不可分。前道工艺负责器件的构建,后道工艺负责器件的连接,二者共同完成从“制造”到“集成”的转变。
从寄生电阻和电容、电迁移两方面说明后道工艺中(Back-End-Of-Line,BEOL)采用铜(Cu)互连和低介电常数(low-k)材料的必要性。相关知识点: 试题来源: 解析 寄生电阻和寄生电容造成的延迟。电子在导电过程中会撞击导体中的离子,将动量转移给离子从而推动离子发生缓慢移动。该现象称为电迁移。在导电过程中,电迁移不...
[3]这部分工艺流程是为了在Si衬底上实现N型和P型场效应晶体管,又被称为前道(front end of line,FEOL)工艺。与之相对应的是后道(backend of line,BEOL)工艺,后道实际上就是建立若干层的导电金属线,不同层金属线之间由柱状金属相连。目前大多选用Cu作为导电金属,因此后道又被称为Cu互联(interconnect)。这些...
Theback end of line (BEOL)is the final state semiconductor processing that concerns the interconnects that reside in the top part of a chip. In today's advanced IC's, that consists of up to fifteen layers of complex wiring. As device scaling continues to 3 nm and beyond, the interconnects...
后道工艺(Back-End-Of-Line, BEOL)中,为什么需要使用铜互连?Issuing time:2022-07-27 14:41随着半导体技术的发展,超大规模集成电路芯片的集成度已经高达几亿乃至几十亿个器件的规模,两层以上的多层金属互连技术广泛使用。传统的金属互连是由铝金属制成的,但随着集成电路芯片中器件特征尺寸的不断减小,金属互连线中...
Back-end-of-line (BEOL) cleaning typically refers to the removal of residues generated during the gas phase (plasma) etching of dielectric and metal films and, in certain cases, the remaining photoresist. In BEOL cleaning, the presence of metal layers precludes the use of aggressive chemicals ...
Back end of line Back end of line The back end of line(BEOL)is the second portion of IC fabrication where the individual devices(transistors,ca-pacitors,resistors,etc.)get interconnected with wiring on the wafer.[1]BEOL generally begins when thefirst layer of metal is deposited on the ...
问答题从寄生电阻和电容、电迁移两方面说明后道工艺中(Back-End-Of-Line,BEOL)采用铜(Cu)互连和低介电常数(low-k)材料的必要性。 参考答案: 寄生电阻和寄生电容造成的延迟。电子在导电过程中会撞击导体中的离子,将动量转移给离子从而推动离子发生缓慢移动。该现象称为电... 点击查看完整答案...
Back End of the Line (BEOL) Interconnect SchemeThe present disclosure relates to a method of forming a back-end-of-the-line metal interconnect layer. The method is performed by depositing one or more self-assembled monolayers on a semiconductor substrate to define a metal interconnect layer ...
The company said the Supremas will be used in front-end-of-line (FEOL), mid-of-line (MoL) and back-end-of-line (BEOL) strip applications for high-volume production at the 3Xnm technology nodes and advanced device development at the 2Xnm nodes.The systems have begun shipment in Q3 2010...