剩下的Midlayer2 到底层bottomlayer需要背钻Backdrilling。此处第一步就是在Design- Layer Stack Manager – Drill Pair 中设置。如下图所示,起始层Midlayer2,终止层Bottomlayer。切记要勾选Back drill pair选项框表示它是做背钻用的。 步骤2:确保信号层Midlayer1与背钻起始层Midlayer2之间层间距不小于0.3mm。 此处...
We use back-drilling technology (controlled depth in z-axis) to drill out the ‘excess’ copper in the via hole in order to get better signal stability.
It will attenuate the signals at the resonant frequency. Back drilling is performed to remove copper plating after layer 3 up to layer 12 to reduce the stub length. The back drill should be bigger than the original hole size to clear out the unwanted copper. Back drilling a 12 Layer stack...
If the back-drill is bad or failed the short to ground will fail the subsequent electrical tests. The PCB can be repaired by re-drilling the hole or via. The present invention allows for detecting failed back-drills with easy detection in the manufacturing stage using standard equipment and ...
Backdrill Data Show Element visibility (Pins/Vias) DRC and Shape Voiding Board Testability NC Drill and Legend Output Enabling Backdrill Output NC Backdrill Legends Legend Customization Backdrill Cross Section Chart Display view archives of Cadence PCB Best Practices - Working with Backdrilling...
PCB making contact with the barrel of the hole in a specific range. A stub can result from both sides of the board up to but not including either the trace and/or the contact range. The following illustration shows an actual pressfit pin and how a trace entering just above the contact ...
背钻设置(BACK DRILL)原创力文档是网络服务平台方若您的权利被侵害侵权客服qq Backdrill 1.如果net需要Backdrill,需要给net设定Backdrill_max_pth_stub Property BACKDRILL_MAX_PTH_STUB Purpose Identification of nets targeted for backdrilling Usage Required Value Max allowable stub in length (database units) ...
C. Changing the design for backdrilling The engineer tells the PCB designer which holes or nets need to be backdrilled. In either case, a lot of manual poking around on the board is necessary to locate the desired vias and replace them with new vias that have modified drill figures and/...
18L with Resin plug+back drill 18 layers, ENIG surfacement, 2.5mm finished board thickness, Size: 414*334mm, Material: Nelco N4000-13EPSI , Resin plug hole+back drill Product Message Product Details 18 layers, ENIG surfacement, 2.5mm finished board thickness, Size: 414*334mm, ...
Key words Back to Drill; The Pillars; Signal Loss 1 背钻对信号传输影响 所有高科技高附加值的产品的共性是在设计上都 追求低功耗、低电磁辐射、高可靠性、小型化、轻型 化、信号传输高速化的特点,而要在设计上达到以上 要求,PCB高速信号传输线路设计是其关键因素。一 般来说,一块PCB要使信号高速传输,在...