Chipset Intel® B560 référence rapide avec les spécifications, les fonctionnalités et les technologies.
Intel® B560 Chipset quick reference with specifications, features, and technologies.
Intel® B560 Chipset 2 x PCIe 3.0 x1 slots Total supports 2 x M.2 slots and 6 x SATA 6Gb/s ports Intel® 11th Gen Processors M.2_1 slot (Key M), type 2242/2260/2280 - Only Intel® 11th Gen processors support PCIe 4.0 x4 mode, this slot will be disabled for other ...
SATAIII 網路介面 TPM (header) USB 3.2 ports (Front) USB 3.2 ports (Rear) USB 2.0 接孔 (前端) USB 2.0 接孔 (背板) 音源接孔 (背板) 序列埠 (前端) HDMI DirectX 尺寸 支援系統 1200 i9 Intel® B560 Chipset 5200(OC) / 5066(OC) / 5000(OC) / 4800(OC) / 4600(OC) / 4533(OC) ...
Intel® B560 Chipset Memory 4 x DIMM, Max. 128GB,DDR4 4600(OC)/4400(OC)/4266(OC)/4000(OC)/3733(OC)/3600(OC)/3466(OC)/3333(OC)/3200(OC)/2933/2800/2666/2400/2133 MHz Non-ECC, Un-buffered memoryDual channel memory architectureSupports Intel® Extreme Memory Profile (XMP)ASUS Opt...
Intel® B560 Chipset M.2_2 slot (Key M), type 2242/2260/2280 (supports PCIe 3.0 x4 & SATA modes)* 6 x SATA 6Gb/s ports To enable Intel® Optane™ Memory (Hybrid Storage device), it must be installed in PCH-attached slots with Intel® Rapid Storage Technology. * M....
SATAIII 網路介面 TPM (header) USB 3.2 ports (Front) USB 3.2 ports (Rear) USB 2.0 接孔 (前端) USB 2.0 接孔 (背板) 音源接孔 (背板) HDMI DisplayPort DirectX 尺寸 CrossFire 支援系統 1200 i9 Intel® B560 Chipset 5066(OC)/ 5000(OC)/ 4800(OC)/ 4600(OC)/ 4533(OC)/ 4400(OC)/ 430...
SATAIII M.2 Slot USB 3.2 ports (Front) USB 3.2 ports (Rear) USB 2.0 ports (Front) USB 2.0 ports (Rear) Audio ports (Rear) DisplayPort HDMI CrossFire CPU Support Form Factor 1200 Intel® B560 Chipset Dual 4 128 2 1 6 2 1(Gen 2, Type C), 2(Gen 1, Type A) ...
Produkte mit früherer Bezeichnung Rocket Lake Vertikales Segment Desktop Status Discontinued Einführungsdatum 01'21 Verlustleistung (TDP) 6 W Empfohlener Kundenpreis $30.00 Unterstützt Übertaktung Memory Einsatzbedingungen PC/Client/Tablet ...
Intel® B560 Chipset - Ordering and trade compliance information inclusive of change notifications, material declarations, ordering codes and trade compliance information.