A copper alloy composition comprising 100 parts by weight of powder of copper alloy represented by the general formula Agx Cuy (wherein x and y are atomic ratio values; 0.001≤×≤0.999, 0.001≤y≤0.999, x+y=1), 5 to 200 parts by weight of one or more organic binders and 0.01 to 10...
(4) Aside for the parts required for the manifold valve, there is no need for addition of other parts for forming the interlock mechanism. The minimum extent of parts is enough to form the interlock mechanism, so assembly of the valve is easy and the production costs can be kept low. ...
10.A curable composition for sealing a light emitting device, comprising100 parts by mass of a modified polysiloxane containing, in a molecule, not less than one alicyclic hydrocarbon group and not less than two epoxy groups, 0.1 to 100 parts by mass of an epoxy resin and 1 to 200 parts ...