A plasma processing chamber for processing a substrate to form electronic components thereon is disclosed. The plasma processing chamber includes a plasma-facing component having a plasma-facing surface oriented toward a plasma in the plasma processing chamber during processing of the substrate, the ...
A plasma processing chamber for processing a substrate to form electronic components thereon is disclosed. The plasma processing chamber includes a plasma-facing component having a plasma-facing surface oriented toward a plasma in the plasma processing chamber during processing of the substrate, the plas...
也將提出預防RF Plasma Arcing 之方法,並實驗改變各種製程參數如增加 Pre coat二氧化矽或改變陽極膜厚度,改變腔體壓力, RF 功率等,討論改變參數後對 Arcing 發生頻率的影響,設計新Top Plate ,試驗對Wafer Arcing 之影響.The thesis is about the investigation of ASM PECVD process plasma arcing issue in the ...
A method and apparatus for preventing arcing at a port exposed to a plasma in a plasma chamber use circuit components causing a door sealing the port to provide a short circuit path at excitation frequency of the plasma. In one embodiment, the door is a slit valve door sealing a substrate...
Microarcing at the chamber wall in RF plasma is studied in PECVD type system. A Langmuir probe is used to measure the plasma potential. This system and pro... Y Yin,MMM Bilek,DR Mckenzie,... - 《Surface & Coatings Technology》 被引量: 19发表: 2005年 Performance of the Scattering Matr...
The pressure distribution in an arcing chamber is critically important for the SF_6puffer circuit breaker design.In this paper,the pressure variation of fo... 钟建英,郭煜敬,张豪,... - 《Plasma Science\s&\stechnology》 被引量: 0发表: 2016年 Puffer type circuit breaker with arcing chamber,...
Configuration for detecting in situ (in-situ) arcing events in the plasma processing chamber, and a method of detecting an arcing event. The said constitution is allotted on the surface of the processing chamber, in order at least to measure one plasma process parameter, is constituted, probe ...
In addition, equipment operation parameter settings and process recipes can be optimized to reduce wafer arcing frequency. Providing an advanced chamber design has enabled us to achieve superior wafer arcing performance of less than 1 in 20,000 wafers. 展开 ...
The collection of data is initiated based on measured voltages in the sputtering source target (), whereas... JE Poole,Charles E. Wickersham - US 被引量: 120发表: 2005年 Highly stabilized sputter deposition of YBa2Cu3O7 A method of stabilizing and homogenizing the plasma during on‐axis ...
摘要: A drive belt system comprises a drive belt that is conductive. The drive belt system further comprises ground coupling means, such as a conductive brush or rubbing material, arranged for coupling the drive belt to ground. As a result, arcing in the drive belt system is reduced....