It is hoped that the problems considered may prove of more than academic interest. Three of them are concerned with stresses due to thermal straining—a current fashion in the aircraft structural field — and were originally presented in an A.R.C. paper.*...
R. Eslami, Thermal stresses: advanced theory and applications, Solid Mechanics and its ... M Berg 被引量: 0发表: 2016年 COUPLED THERMOELASTICITY OF SHELLS OF REVOLUTION: EFFECT OF NORMAL STRESS AND COUPLING [Hetnarski and Eslami 2009] R. B. Hetnarski and M. R. Eslami, Thermal stresses...
At its early stages of development, thermal spray technology was mostly used for the repair, rebuilding, retrofitting, and for surface protection against corrosion, erosion and wear. The wider acceptance of the technology for industrial-scale production has started in the late eighties and early nine...
Additionally, finite element analyses were used to check the thermal stress profiles and the stress intensity factors derived from the analytical model. The resulting predictions of crack growth life are comparable with those reported in the... R Vasile,P Elena,T Nigel,... 被引量: 7发表: 2007...
Thermophysiological models are part of the prediction method for evaluating thermal comfort and sensation. The calculated output of the thermophysiological model (core and skin temperature) are used as input for thermal sensation models that predict thermal comfort and sensation. The development of the...
Cross sectioning is performed finally to characterize the loss of electrical connectivity. Fracture of plated copper, due to the thermal expansion mismatch between constituents, is shown to be responsible for the failure of the PCB. In addition to environmental tests, finite element model is ...
& Eom, C. Tailoring the domain structure of epitaxial BiFeO3 thin films. Curr. Opin. Sol. State Mater. Sci. 18, 39–45 (2014). CAS Google Scholar Zhang, J., Weiss, C. V. & Alpay, S. P. Effect of thermal stresses on the dielectric properties of strontium titanate thin films. ...
The determination of possible failure mechanisms and advance in reliability are essential aims in modern micro electronics. Thermal and mechanical strength cannot be avoided in technological processes and under use. In general, this leads to three dimensional stress and strain fields with concentrations ...
Stress evolution in thermal barrier coatings for rocket engine applications. Mechanics of Advanced Materials and Modern Processes 2015; 1(1):1-10.M. Baker, T. Fiedler, J. Rosler, Stress evolution in thermal barrier coatings for rocket engine applications, Mechanics of Advanced Materials and Modern...
Crystallization induced by thermal aging led to higher creep resistance, but lower capability of crack healing when inspected by electron microscopy. However, potential of stress relaxation in the aged material was confirmed by the constitutive mechanical models of viscoelasticity. 展开 关键词: Glass ...