An Antenna-in-Package (AiP) includes an interface layer, an integrated circuit die disposed on the interface layer, a molding compound disposed on the interface layer and encapsulating the integrated circuit die, and a plurality of solder balls disposed on a bottom surface of the interface layer...
采用封装天线(Antenna-in-Package,AiP)技术的雷达芯片 在汽车应用方面,射频(RF)CMOS是雷达集成电路(IC)的下一代技术,其优点之一是低功耗。该优点对于物联网领域等也很有吸引力。实际上,低功耗雷达芯片适用于停车管理、机器人避障、手势识别、人体感应、液位计/物位计等应用。 据麦姆斯咨询介绍,Acconeer是一家位于...
Amkor's Antenna in Package (AiP)/Antenna on Package (AoP) offers fully integrated 5G mmWave & sub-6 GHz RF modules for smartphones & other mobile devices.
采用封装天线(Antenna-in-Package,AiP)技术的雷达芯片 在汽车应用方面,射频(RF)CMOS是雷达集成电路(IC)的下一代技术,其优点之一是低功耗。该优点对于物联网领域等也很有吸引力。实际上,低功耗雷达芯片适用于停车管理、机器人避障、手势识别、人体感应、液位计/物位计等应用。 据麦姆斯咨询介绍,Acconeer是一家位于...
Antenna in Package (or AiP) is an new trend in IC packaging which is an enabler of smaller and high integrated ICs that consists of ICs and Antenna inside a package. Antenna in Package allows integration of all the complex RF components, together with the base-band circuitry into a complete...
This report presents a package analysis (PKG) on the USI 339M00227 mmWave AiP device. The 339M00227 AiP contains a radio frequency TX/RX transceiver die and an antenna array formed from the metallization layers of a printed wiring board (PWB). A power management integrated circuit (PMIC) ...
This report presents a package analysis (PKG) on the USI 339M00227 mmWave AiP device. The 339M00227 AiP contains a radio frequency TX/RX transceiver die and an antenna array formed from the metallization layers of a printed wiring board (PWB). A power management integrated circuit (PMIC) ...
We present an antenna-in-package system integrated with a meander line antenna based on low temperature co-fired ceramic(LTCC) technology. The proposed system employs a meander line patch antenna, a packaging layer, and a laminated multi-chip module(MCM) for integration of integrated circuit(IC)...
Antenna-in-Package (AiP) Technology 来自 万方 喜欢 0 阅读量: 59 作者: Y Zhang 摘要: 1. Introduction Since the mid-1990s, the complementary metal oxide semicon-ductor (CMOS) has been the technological driver for the wireless revolution [1], enabling the full syste... 查看全部>> 年份:...
This report presents a package analysis (PKG) on the USI 339M00227 mmWave AiP device. The 339M00227 AiP contains a radio frequency TX/RX transceiver die and an antenna array formed from the metallization layers of a printed wiring board (PWB).