Ansys Mechanical provides topology optimization to deliver an affordable, enhanced physics-based concept during a product’s early design phase. This helps engineers consider static, dynamic and thermal loading scenarios and incorporate several manufacturing constraints for optimizing a component for a ...
Topology Optimization Ansys Topology Optimization produces design insights in real-time, driving inspiration and lightweighting design possibilities in less time. Thermal Analysis Simulation Ansys thermal analysis solutions help engineers solve the most complex thermal challenges to predict the effects of ...
解決方案的新提升大幅改善用戶解決接點組裝問題的方式,讓工程師運用高效能預算(HPC)並以高達兩倍的速度完成某些模型。ANSYS Mechanical的topology optimization功能亦導入thermal 剛性的目標函數,幫助用戶產生能將熱傳導最大化的設計。 ANSYS Mechanical功能較先前版本更強大,能正確解決困難的非線性機械問題。針對高度變形幾何...
30StaticStructural(Samcef)31Steady-StateThermal32Steady-StateThermal(ABAQUS)33Steady-StateThermal(Samcef)34Thermal-Electric35Throughflow36Throughflow(BladeGen)37TopologyOptimization38TransientStructural39TransientStructural(ABAQUS)40TransientStructural(Samcef)41TransientThermal42TransientThermal(ABAQUS)43TransientThermal(...
1.Afterwards,the finite-element method (FEM) and its solution process, andANSYS/Thermalsolution process in steady and unsteady seepage were introduced.本文首先介绍了渗流基本理论和控制方程,对比渗流方程和热方程的相似性,在此基础上得出可以利用ANSYS热模块计算分析坝体渗流问题的结论。
We work with companies that are interested in optical and mechanical analysis, and that has always been challenging because you had different companies providing the tools. Ansys can now provide full solutions from the optical side to the photonics side, and on the structural thermal side. Th...
用以考虑重熔现象 2020 R2 2021 R1 Additive Science 新功能 • 扩展 "use provided thermal parameters" 选择范围 From UI From 2021 R1 Documentation Workbench Additive 2021 R1增材方案更新 • 增材向导新增标定流程 • 新增AM Bond接触,并可通过向导设置 • 默认添加层四面体网格方式.此网格匹配零 件...
As noted in Ansys, in the presented release, ANSYS Discovery Live continues to automate and simplify modeling. Added the ability to simulate the passage of electric current; related tasks, including thermal stress strains; Instantly validate and rebuild topological optimization results. Also added: Int...
(IC) technologies and advanced electronic capabilities. Innovations like high-density 3D-ICs enable product development teams to pack more features in a smaller space, but those compact form factors complicate thermal, electromagnetic (EM), and power challenges. All major semiconductor foundries have ...
Topology Optimization Extension for ANSYS Mechanical